BA23 Enclosure - Revision history

Jnc: +New category

2024-07-26T15:14:57Z

+New category

Jnc: link to MicroNote online

2024-07-24T01:26:44Z

link to MicroNote online

Jnc: /* Cooling Considerations */ Avoid redirs

2024-07-23T13:28:14Z

‎Cooling Considerations: Avoid redirs

Glitch: /* BA23 H9278 Backplane */

2024-07-19T12:38:22Z

‎BA23 H9278 Backplane

Glitch: /* Cooling Considerations */

2024-07-19T12:31:04Z

‎Cooling Considerations

Glitch: /* Cooling Considerations */

2024-07-19T12:28:57Z

‎Cooling Considerations

Glitch: Adding section for BA23 cooling considerations

2024-07-19T12:23:14Z

Adding section for BA23 cooling considerations

Glitch: /* BA23 H7864 Power Supply */

2024-07-19T12:20:52Z

‎BA23 H7864 Power Supply

Glitch: /* External links */

2024-07-19T12:16:26Z

‎External links

Glitch: /* External links */

2024-07-19T12:15:33Z

‎External links

← Older revision		Revision as of 15:14, 26 July 2024
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	[[Category: DEC Mounting Boxes]]		[[Category: DEC Mounting Boxes]]
		+	[[Category: QBUS Hardware]]

@@ Line 82: / Line 82: @@
 ===Termination===
-The BA23 backplane includes removable SIP termination resistors at the bottom. Termination may be 120 ohms or 240 ohms, depending on processor board. Per [[DEC MicroNote 35, "Q-bus Expansion Concepts"]], these termination packs are removed when an expansion chassis is used with the BA23. Keep this in mind when separating an expanded QBus system!
+The BA23 backplane includes removable SIP termination resistors at the bottom. Termination may be 120 ohms or 240 ohms, depending on processor board. Per [[MicroNote]] #35, "Backplane Expansion/Termination" (below), these termination packs are removed when an expansion chassis is used with the BA23. Keep this in mind when separating an expanded QBus system!
 ==BA23 Internal Cabling==
@@ Line 166: / Line 166: @@
 * [http://bitsavers.trailing-edge.com/scandocs.trailing-edge.com/micropdp11-volume_2_enclosures-EK-186AA-MG-001.pdf BA23 Enclosure Maintenance] (EK-186AA-MG-001)
 * [http://filedump.glitchwrks.com/cap_lists/dec_ba23_aa12131.pdf DEC BA23 AA12131 Power Supply Capacitor List]
 [[Category: DEC Mounting Boxes]]

@@ Line 157: / Line 157: @@
 ==Cooling Considerations==
-The BA23 uses an airflow path which pulls cooling air through the card cage, into the [[power supply]], and exhausts it through the top (in vertical orientation) or left (horizontal orientation, from the front) side of the chassis through two 120V 120mm fans. The fan closest to the rear of the chassis is mostly responsible for power supply and [[QBus]] card cage cooling, the fan closest to the front of the chassis handles storage area cooling.
+The BA23 uses an airflow path which pulls cooling air through the card cage, into the [[power supply]], and exhausts it through the top (in vertical orientation) or left (horizontal orientation, from the front) side of the chassis through two 120V 120mm fans. The fan closest to the rear of the chassis is mostly responsible for power supply and [[QBUS]] card cage cooling, the fan closest to the front of the chassis handles storage area cooling.
-Operating the BA23 with the I/O panel removed may reduce cooling efficiency, leading to hot running or overheating when running programs which stress the system, such as the [[XXDP]] '''VMJAB0''' memory exerciser, especially in configurations that include a [[KDJ11-B]]. The intake side of the chassis should be kept free from obstructions during operation, as the fans in the output side will pull intake air from the path of least resistance.
+Operating the BA23 with the I/O panel removed may reduce cooling efficiency, leading to hot running or overheating when running programs which stress the system, such as the [[XXDP diagnostic package|XXDP]] '''VMJAB0''' memory exerciser, especially in configurations that include a [[KDJ11-B CPU|KDJ11-B]]. The intake side of the chassis should be kept free from obstructions during operation, as the fans in the output side will pull intake air from the path of least resistance.
 When operating the BA23 in a rack mounted configuration, ensure adequate intake and exhaust airflow. This often precludes the use of rack side skins.

← Older revision		Revision as of 12:38, 19 July 2024
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	<br clear=all>		<br clear=all>
		+
		+	===Termination===
		+
		+	The BA23 backplane includes removable SIP termination resistors at the bottom. Termination may be 120 ohms or 240 ohms, depending on processor board. Per [[DEC MicroNote 35, "Q-bus Expansion Concepts"]], these termination packs are removed when an expansion chassis is used with the BA23. Keep this in mind when separating an expanded QBus system!

	==BA23 Internal Cabling==		==BA23 Internal Cabling==

@@ Line 153: / Line 153: @@
 ==Cooling Considerations==
-The BA23 uses an airflow path which pulls cooling air through the card cage, into the power supply, and exhausts it through the top (in vertical orientation) or left (horizontal orientation, from the front) side of the chassis through two 120V 120mm fans. The fan closest to the rear of the chassis is mostly responsible for power supply and QBus card cage cooling, the fan closest to the front of the chassis handles storage area cooling.
+The BA23 uses an airflow path which pulls cooling air through the card cage, into the [[power supply]], and exhausts it through the top (in vertical orientation) or left (horizontal orientation, from the front) side of the chassis through two 120V 120mm fans. The fan closest to the rear of the chassis is mostly responsible for power supply and [[QBus]] card cage cooling, the fan closest to the front of the chassis handles storage area cooling.
-Operating the BA23 with the I/O panel removed may reduce cooling efficiency, leading to hot running or overheating when running programs which stress the system, such as the XXDP '''VMJAB0''' memory exerciser, especially in configurations that include a KDJ11-B. The intake side of the chassis should be kept free from obstructions during operation, as the fans in the output side will pull intake air from the path of least resistance.
+Operating the BA23 with the I/O panel removed may reduce cooling efficiency, leading to hot running or overheating when running programs which stress the system, such as the [[XXDP]] '''VMJAB0''' memory exerciser, especially in configurations that include a [[KDJ11-B]]. The intake side of the chassis should be kept free from obstructions during operation, as the fans in the output side will pull intake air from the path of least resistance.
 When operating the BA23 in a rack mounted configuration, ensure adequate intake and exhaust airflow. This often precludes the use of rack side skins.

← Older revision		Revision as of 12:28, 19 July 2024
Line 152:		Line 152:

	==Cooling Considerations==		==Cooling Considerations==
		+
		+	The BA23 uses an airflow path which pulls cooling air through the card cage, into the power supply, and exhausts it through the top (in vertical orientation) or left (horizontal orientation, from the front) side of the chassis through two 120V 120mm fans. The fan closest to the rear of the chassis is mostly responsible for power supply and QBus card cage cooling, the fan closest to the front of the chassis handles storage area cooling.
		+
		+	Operating the BA23 with the I/O panel removed may reduce cooling efficiency, leading to hot running or overheating when running programs which stress the system, such as the XXDP '''VMJAB0''' memory exerciser, especially in configurations that include a KDJ11-B. The intake side of the chassis should be kept free from obstructions during operation, as the fans in the output side will pull intake air from the path of least resistance.
		+
		+	When operating the BA23 in a rack mounted configuration, ensure adequate intake and exhaust airflow. This often precludes the use of rack side skins.

	==External links==		==External links==

← Older revision		Revision as of 12:23, 19 July 2024
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	You can install three more type A inserts by removing the bracket between the third and fourth cutouts and installing an adapter plate.		You can install three more type A inserts by removing the bracket between the third and fourth cutouts and installing an adapter plate.
		+
		+	==Cooling Considerations==

	==External links==		==External links==

@@ Line 109: / Line 109: @@
 You can increase the fan voltages to +12 Vdc by changing a power supply jumper.
 The [[KA630]] CPU module’s thermal and acoustical specifications for example, are based on the +10 volt setting.
 The required fan power does not affect the 230 W output.
 ==BA23 I/O Panel==

← Older revision		Revision as of 12:15, 19 July 2024
Line 148:		Line 148:

	* [http://bitsavers.trailing-edge.com/scandocs.trailing-edge.com/micropdp11-volume_2_enclosures-EK-186AA-MG-001.pdf BA23 Enclosure Maintenance] (EK-186AA-MG-001)		* [http://bitsavers.trailing-edge.com/scandocs.trailing-edge.com/micropdp11-volume_2_enclosures-EK-186AA-MG-001.pdf BA23 Enclosure Maintenance] (EK-186AA-MG-001)
		+	* [http://filedump.glitchwrks.com/cap_lists/dec_ba23_aa12131.pdf] (DEC BA23 AA12131 Power Supply Capacitor List)

	[[Category: DEC Mounting Boxes]]		[[Category: DEC Mounting Boxes]]