Dual Inline Package - Revision history

Jnc: +cat

2018-12-16T00:15:59Z

+cat

2018-03-15T08:28:54Z

Avoid redir

2017-12-17T09:25:24Z

Mention dual row of contacts

2017-12-17T09:12:48Z

Jnc moved page DIP to Dual Inline Package: full name

2017-12-17T09:12:30Z

Improve somewhat

2012-11-26T13:02:17Z

Added short page for DIP

New page

DIP: '''D'''ual '''I'''n Line '''P'''ackage, the basic IC design used for e.g. the 78xx TTL Integrated Circuits, and all early microprocessors.

← Older revision		Revision as of 00:15, 16 December 2018
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	It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in [[printed circuit board]]s, using the so-called '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc).		It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in [[printed circuit board]]s, using the so-called '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc).
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		+	[[Category: Components]]

← Older revision		Revision as of 08:28, 15 March 2018
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−	'''Dual Inline Package''' (usually given as the acronym, '''DIP'''), the basic physical packaging used for most [[integrated circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the ~~74xx~~ [[~~transistor–transistor~~ logic‎\|TTL]] series, and all early [[microprocessor]]s.	+	'''Dual Inline Package''' (usually given as the acronym, '''DIP'''), the basic physical packaging used for most [[integrated circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the [[74 series]] [[transistor-transistor logic‎\|TTL]] series, and all early [[microprocessor]]s.

	It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in [[printed circuit board]]s, using the so-called '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc).		It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in [[printed circuit board]]s, using the so-called '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc).

← Older revision		Revision as of 09:25, 17 December 2017
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	'''Dual Inline Package''' (usually given as the acronym, '''DIP'''), the basic physical packaging used for most [[integrated circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the 74xx [[transistor–transistor logic‎\|TTL]] series, and all early [[microprocessor]]s.		'''Dual Inline Package''' (usually given as the acronym, '''DIP'''), the basic physical packaging used for most [[integrated circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the 74xx [[transistor–transistor logic‎\|TTL]] series, and all early [[microprocessor]]s.

−	It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to metal 'legs' which are bent down to pass through holes drilled in [[printed circuit board]]s, ~~whence~~ the ~~name~~ '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc).	+	It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in [[printed circuit board]]s, using the so-called '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc).

← Older revision		Revision as of 09:12, 17 December 2017
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−	~~DIP:~~ '''D'''~~ual~~ '''I'''~~n Line '''P'''ackage~~, the basic ~~IC design~~ used for e.g. the ~~78xx~~ TTL ~~Integrated Circuits~~, and all early ~~microprocessors~~.	+	'''Dual Inline Package''' (usually given as the acronym, '''DIP'''), the basic physical packaging used for most [[integrated circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the 74xx [[transistor–transistor logic‎\|TTL]] series, and all early [[microprocessor]]s.
		+
		+	It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to metal 'legs' which are bent down to pass through holes drilled in [[printed circuit board]]s, whence the name '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc).

← Older revision	Revision as of 09:12, 17 December 2017
(No difference)