Jnc: Created page with "'''Surface mount''' is the generation of packaging technology after Dual Inline Packages; instead of leads which are placed in through-holes, surface mount components mere..."

2019-01-03T01:30:51Z

Created page with "'''Surface mount''' is the generation of packaging technology after Dual Inline Packages; instead of leads which are placed in through-holes, surface mount components mere..."

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'''Surface mount''' is the generation of packaging technology after [[Dual Inline Package]]s; instead of leads which are placed in through-holes, surface mount components merely have small [[conductor]] protrusion [[contact]]s, which are joined to small '''pad'''s on [[printed circuit board]]s created to hold surface mount components.

The contacts on suface mount components can be much smaller than the leads needed for through-holes, and routing of conductors is easier on boards without through holes; these mean that surface mount devices can be mounted more densely.

[[Category: Components]]

Surface mount - Revision history

Jnc: Created page with "'''Surface mount''' is the generation of packaging technology after Dual Inline Packages; instead of leads which are placed in through-holes, surface mount components mere..."