Difference between revisions of "Dual Inline Package"
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| − | + | '''Dual Inline Package''' (usually given as the acronym, '''DIP'''), the basic physical packaging used for most [[integrated circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the [[74 series]] [[transistor-transistor logic|TTL]] series, and all early [[microprocessor]]s. | |
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| + | It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in [[printed circuit board]]s, using the so-called '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc). | ||
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| + | [[Category: Components]] | ||
Latest revision as of 01:15, 16 December 2018
Dual Inline Package (usually given as the acronym, DIP), the basic physical packaging used for most integrated circuits from the late 1960s until the development of surface mount technology; e.g. the 74 series TTL series, and all early microprocessors.
It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in printed circuit boards, using the so-called through-hole technology (also used for discrete components such as resistors, capacitors, etc).
