Surface mount

Surface mount is the generation of packaging technology after Dual Inline Packages; instead of leads which are placed in through-holes, surface mount components merely have small conductor protrusion contacts, which are joined to small pads on printed circuit boards created to hold surface mount components.

The contacts on suface mount components can be much smaller than the leads needed for through-holes, and routing of conductors is easier on boards without through holes; these mean that surface mount devices can be mounted more densely.