Difference between revisions of "MF20 MOS memory"
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The '''MF20''' was a [[Metal Oxide Semiconductor|MOS]] [[Dynamic RAM|DRAM]] [[main memory]] system for the later [[PDP-10]]s, principally the final [[KL10]]s (models KL10-E and KL10-R). An MF20 contained up to three storage groups, each with 256KW, for a maximum of 768KW; up to 4 MF20's could be connected to a single system, for a total of up to 3072KW. | The '''MF20''' was a [[Metal Oxide Semiconductor|MOS]] [[Dynamic RAM|DRAM]] [[main memory]] system for the later [[PDP-10]]s, principally the final [[KL10]]s (models KL10-E and KL10-R). An MF20 contained up to three storage groups, each with 256KW, for a maximum of 768KW; up to 4 MF20's could be connected to a single system, for a total of up to 3072KW. | ||
| − | The [[access time]] is .80 µseconds at the [[Central Processing Unit|CPU]], and the [[cycle time]] is 1.00 µseconds (both for the first [[word]] in a 4-word block). <!-- Refresh time is 570 nsec (typical; 610 nsec maximum); the time for a complete refresh pass is 14.5 μsec (typical), 13.5 μsec (minimum). --> [[Error-correcting code|ECC]] is provided to protect the memory contents. The MF20 | + | The [[access time]] is .80 µseconds at the [[Central Processing Unit|CPU]], and the [[cycle time]] is 1.00 µseconds (both for the first [[word]] in a 4-word block). <!-- Refresh time is 570 nsec (typical; 610 nsec maximum); the time for a complete refresh pass is 14.5 μsec (typical), 13.5 μsec (minimum). --> The MF20 connected to the KL10's upgraded internal memory bus, the [[PDP-10 Memory Bus|X-Bus]]. [[Error-correcting code|ECC]] is provided to protect the memory contents; an MF20 44-[[bit]] word contains 36 data bits, 6 ECC bits, 1 bit of ECC [[parity]], and 1 spare bit. The MF20 can be configured to switch the spare bit in to temporarily replace a failing bit, until the latter can be replaced |
The sizes above are with 16Kx1 [[integrated circuit|chips]]; the manual says that 64Kx1 chips would be supported, giving 1024KW for a group, but it's not clear if this was ever produced; although perhaps this was later named the [[MG20 MOS memory]]. | The sizes above are with 16Kx1 [[integrated circuit|chips]]; the manual says that 64Kx1 chips would be supported, giving 1024KW for a group, but it's not clear if this was ever produced; although perhaps this was later named the [[MG20 MOS memory]]. | ||
| − | [[Category: PDP-10 | + | ==External links== |
| + | |||
| + | * [http://www.bitsavers.org/pdf/dec/pdp10/KL10/MF20_TechMan.pdf MOS Memory Subsystem Technical Manual] (EK-0MF20-TM) | ||
| + | * [http://bitsavers.org/pdf/dec/pdp10/KL10/MF20_schem_May78.pdf MOS Memory MF20 engineering drawings] | ||
| + | * [http://www.bitsavers.org/pdf/dec/pdp10/KL10/MP00622_MF20_Oct82.pdf MF20 Field Maintenance Print Set] (MP00622) | ||
| + | |||
| + | [[Category: PDP-10 Memories]] | ||
Latest revision as of 14:50, 24 October 2022
The MF20 was a MOS DRAM main memory system for the later PDP-10s, principally the final KL10s (models KL10-E and KL10-R). An MF20 contained up to three storage groups, each with 256KW, for a maximum of 768KW; up to 4 MF20's could be connected to a single system, for a total of up to 3072KW.
The access time is .80 µseconds at the CPU, and the cycle time is 1.00 µseconds (both for the first word in a 4-word block). The MF20 connected to the KL10's upgraded internal memory bus, the X-Bus. ECC is provided to protect the memory contents; an MF20 44-bit word contains 36 data bits, 6 ECC bits, 1 bit of ECC parity, and 1 spare bit. The MF20 can be configured to switch the spare bit in to temporarily replace a failing bit, until the latter can be replaced
The sizes above are with 16Kx1 chips; the manual says that 64Kx1 chips would be supported, giving 1024KW for a group, but it's not clear if this was ever produced; although perhaps this was later named the MG20 MOS memory.
