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- ...lable on both the Commodore 64 and the Apple II. Both machines were [[MOS Technology 6502|6502]] based, allowing a lot of code to be shared between the two plat3 KB (414 words) - 15:12, 7 March 2021
- ...tp://www.intel4004.com/ The Intel 4004 Microprocessor and the Silicon Gate Technology]5 KB (796 words) - 16:01, 14 July 2023
- ...usually abbreviated as '''DRAM''', is currently the ubiquitous [[memory]] technology used for [[main memory]] in computers. Contemporary DRAM is implemented in2 KB (240 words) - 02:30, 17 February 2024
- | CPU-technology = CMOS2 KB (174 words) - 06:15, 28 June 2022
- ...book for an EMACS, B.S. Thesis, MIT/LCS/TM-165, Massachusetts Institute of Technology, May 1980.22 KB (3,770 words) - 14:23, 25 August 2021
- | CPU-technology = ECL Gate Array2 KB (274 words) - 22:16, 19 May 2024
- ment in operating systems and networking technology by pro- viding this base technology in a broadly accessible manner.9 KB (1,346 words) - 16:13, 16 December 2018
- ...dule''' (usually abbreviated to '''SIMM''') was a standard [[main memory]] technology in the early [[Pentium]] era.538 bytes (84 words) - 01:43, 20 December 2018
- ...1057_IBM_RT_Personal_Computer_Technology_1986.pdf IBM RT Personal Computer Technology] - covers AIX 1 * [http://ieeexplore.ieee.org/document/109275/ AIX 3 Technology]3 KB (383 words) - 18:08, 2 March 2021
- development in operating systems and networking technology by broadening access to base technology. In cooperation with25 KB (3,920 words) - 05:43, 15 July 2019
- Seagate Technology Seagate Technology online services25 KB (3,017 words) - 18:47, 13 January 2024
- ...was manufactured by several companies including Atmel, Bipolar Integrated Technology, Cypress Semiconductor, Fujitsu, Matsushita and [[Texas Instruments]], etc.1 KB (153 words) - 07:11, 20 February 2024
- | CPU-technology = Bipolar Schottky2 KB (204 words) - 20:47, 19 May 2024
- ...3600 RPM. It was [[Digital Equipment Corporation|DEC]]'S first Winchester-technology disk; it used [[microprocessor]]-based control.1 KB (177 words) - 18:09, 15 August 2023
- * [https://rc.xqwv.org.uk/2014/rx50.html RX50 technology]2 KB (284 words) - 14:45, 15 September 2023
- '''Surface mount''' is the generation of packaging technology after [[Dual Inline Package]]s; instead of leads which are placed in throug601 bytes (88 words) - 03:30, 3 January 2019
- [[Category: Technology]]281 bytes (42 words) - 22:20, 3 March 2019
- technology--potential users evaluate it by trying to fit it into present Another impedance to the acceptance of a breakthrough technology is627 KB (92,395 words) - 03:42, 17 December 2018
- ...circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the [[74 series]] [[transistor-transistor logic|TTL]] series, and ...lled in [[printed circuit board]]s, using the so-called '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, e725 bytes (109 words) - 02:15, 16 December 2018
- - [[Storage Technology Corporation]] - [[Seagate Technology]]47 KB (6,794 words) - 03:55, 18 May 2024