Difference between revisions of "Dual Inline Package"
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| − | + | '''Dual Inline Package''' (usually given as the acronym, '''DIP'''), the basic physical packaging used for most [[integrated circuit]]s from the late 1960s until the development of [[surface mount]] technology; e.g. the 74xx [[transistor–transistor logic|TTL]] series, and all early [[microprocessor]]s. | |
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| + | It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to metal 'legs' which are bent down to pass through holes drilled in [[printed circuit board]]s, whence the name '''through-hole''' technology (also used for discrete components such as [[resistor]]s, [[capacitor]]s, etc). | ||
Revision as of 11:12, 17 December 2017
Dual Inline Package (usually given as the acronym, DIP), the basic physical packaging used for most integrated circuits from the late 1960s until the development of surface mount technology; e.g. the 74xx TTL series, and all early microprocessors.
It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to metal 'legs' which are bent down to pass through holes drilled in printed circuit boards, whence the name through-hole technology (also used for discrete components such as resistors, capacitors, etc).
