Dual Inline Package
From Computer History Wiki
(Redirected from Through-hole technology)
Dual Inline Package (usually given as the acronym, DIP), the basic physical packaging used for most integrated circuits from the late 1960s until the development of surface mount technology; e.g. the 74 series TTL series, and all early microprocessors.
It consists of a ceramic or plastic package, with the actual IC inside, with the leads led out to two rows of metal 'legs' on either side of the package (whence the name), which are bent down to pass through holes drilled in printed circuit boards, using the so-called through-hole technology (also used for discrete components such as resistors, capacitors, etc).
